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Rigid-Flex Turn Key Pcb Assembly Low MOQ And certifications factory in China and Cambodia

Rigid-Flex Turn Key Pcb Assembly Low MOQ And certifications factory in China and Cambodia

Rigid-Flex PCB assembly low MOQ

Quick Turn PCB Assembly factory

PCB Assembly with certifications

Tempat asal:

Cina/Kamboja

Nama merek:

Suntek

Sertifikasi:

ISO9001, ISO13485, TS16949 and UL E476377

Nomor model:

F9632-7582

Hubungi Kami
Minta Kutipan
Detail Produk
Tempat asal:
CINA
Bahan dasar:
FR4+PI, PI/Custom
Perawatan permukaan:
Enig
Kepatuhan Rohs:
Ya
Qty:
Dukung prototipe dan produksi batch
SUFACE:
ENIG 2u
Ketebalan tembaga:
0.5-6oz
Kontrol Impedansi:
50/90/100 ± 10% ohm
Syarat Pembayaran & Pengiriman
Kuantitas min Order
1 pcs
Harga
USD1
Kemasan rincian
Vakum, anti-statis, ESD, karton
Waktu pengiriman
1-2 minggu setelah semua bagian dikumpulkan
Syarat-syarat pembayaran
T/t, paypal
Menyediakan kemampuan
100 pcs/jam
Deskripsi produk

Suntek provide:

-PCB/FPC fabrication

-Components sourcing

-PCB/FPC assembly

-Custom cable/harness assembly

-Box build

Services as below:

-SMT, THT, BGA,0201 Chips assembly

-AOI, X-Ray, ICT, FT, Burn-in

-Conformal coating or gluing

-High-mix, small to medium volume

With certification by ISO9001, ISO13485, TS16949 and UL .

 

SMT Parameters:

 

H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT

◆SMT machine(for printing,pick place,reflow soldering)

◆THT machine(for wave soldering)

◆Terminal machine...

◆AOI

◆X-RAY

◆injection molding machine

◆AI(Automatic Inserting machine)...

M 中

◆SMT+ICT

◆THT+FT

◆SMT+THT

◆THT+Harness+FT

◆Assembly+FT

◆ Genera SMD+DIP

◆ DIP parts+ Harness

◆SMD+DIP+Harness without injection molding

◆≤0201 SMD

◆BGA,LGA,FBGA,LCC+LGA ◆Harness+injection molding

◆Conformal coating

S 低

◆纯SMT(Only SMT)

◆纯THT(Only THT)

◆纯线束(Only Harness)

◆纯组装(Only Assembly)

◆代工代料 Material+ Assembly ◆设计+代工代料 Design+Meterial+Assembly
  low higher highest

 

 

Technology Involved:

 

Technology Circuit PCB/Flex/Metal PCB/Rigid-Flex Parameter Assembly Side Single/Double
Process SMT Min Size 10mm * 10mm
THT Max Size 410mm * 350mm
Punch Thickness 0.38mm ~ 6.00mm
In-circuit Test Function Test Min Chip 0201 chip
Glue,Burn-in Conformal Coating Fine-pitch 0.20mm
BGA Re-work BGA ball size 0.28mm

 

Special Technology Involved

◆ IC Programming

◆ BGA rework

◆ Chip on Board/COB

◆ Eutectic soldering

◆ Auto-Gluing

◆ Conformal Coating


 

Assemly Flow Chart:

Rigid-Flex Turn Key Pcb Assembly Low MOQ And certifications factory in China and Cambodia 0

Rigid-Flex Turn Key Pcb Assembly Low MOQ And certifications factory in China and Cambodia 1

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